Oxide Polishing Suspensions

Oxide Polishing Suspensions

For final polishing.
With antidrying agent.
Shake before use.

General Info

For the final polishing step, where the very last deformations have to be removed, sub-micron sized oxide polishing suspensions are used.
 
For general applications alumina suspension is used, and for the more demanding applications silica suspensions are the best choice.
 
The silica suspensions perform a chemical-mechanical polishing action. During polishing, the sample surface is slightly attacked. The resulting layer is removed by the sub-micron silica grains, leaving the sample surface absolutely deformation-free.
 
We offer a wide selection of silica and alumina suspensions for the final polishing of different materials:
 
• The super fine grained colloidal silica or the slightly coarser fumed silica suspensions
 
• Grain sizes from 0.050 μm to 0.2 μm (50 to 200 nm)
 
• Unique system to prevent crystal formation
 
• Our unique water-free suspension of 0.2 μm fumed silica
 
• The neutral alumina suspension

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